Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...

One way of viewing efforts by storage suppliers to move into data management over the past couple of years is that storage technology is emerging from the backroom and wants to be at the centre of ...

Abstract: In the directional antenna element-based uniform arc array (DA-UAA), the conventional spatial spectrum estimation algorithms such as multiple signal classification could not be utilized to ...